Our Touch Cooling technology has been designed from the ground up to be highly reliable and easy to service in addition to offering leading edge density and energy savings and CPU performance enhancement. In our initial deployment we demonstrated a cooling overhead of just 4% of motherboard power consumption and the ability to run the CPUs in turbo (i.e. over clocked) mode for extended periods. In addition there have been no server failures after 2,000,000 server hours even though the system is housed in a tool room just off a loading dock.
The elimination of air as the cooling medium frees up to 20% of stranded power previously reserved to power fans at full speed. In addition as liquid cooling is so much more efficient, existing CPUs can be run permanently in turbo mode or replaced with higher power, high performance devices. Consequently the user can either cut capex and opex by buying fewer servers for the same compute load or doubling compute capacity while still remaining in the same nameplate power envelope. In addition elimination of air as the heat removal medium can eliminate hundreds of sensors, baffles and grommets, eases moves and does away with the need to perform CFD studies every time there is a configuration change.
Reduced power and higher density permits more servers to be added to previously “full” data center legacy sites, postponing the need for a new build.
In green field deployments further capex and opex savings can be realized. Chillers and CRAHs can be replaced by dry coolers, adiabatic coolers or cooling towers and the amount of white space reduced by 80% (4 kw per square foot is easily achievable). As no conditioned space is required, systems can be deployed in any existing building with access to adequate power. Another advantage of higher density is the reduction interconnect distances which in turn reduces cabling tangle in big systems, lessens networking power requirements and increases communication speeds.Overall, energy consumption can be reduced by 20% to 50% compared with traditional data centers.
Modules could be as much as 75% smaller through the application of Touch Cooling. The large reduction in density and complexity engendered in a Touch Cooling system makes it an excellent design choice for Modules, especially as a replacement for the free air cooling systems currently used. These have significant issues with keeping filters clean, corrosion inducing gases or particulates, water conditioning and rapid temperature changes. Touch Cool Modules have none of these drawbacks.
Unlike other liquid cooling systems Touch Cooling does not require liquid in the server. That is, servers do not need to be immersed in a cooling liquid or be internally plumbed to carry coolant to each hot chip. Both approaches introduce reliability and serviceability issues. In contrast, Touch Cool is built into the rack and all liquid connections are brazed or soldered, reducing the probability of leaks to near zero.
Touch Cooling enhances reliability. Fan induced vibration, hot spots and sudden temperature swings are totally eliminated, all of which will effect failure rate. Also, in the event of a cooling system failure in an air cooled high power system thermal runaway occurs causing the systems to shut down in seconds because air has a very low heat capacity. Touch Cooling, on the other hand uses heat spreaders with a high thermal inertia in addition to a volume of circulating coolant. While it is not feasible to run CRAH fans off a UPS due to their high power needs, as pumps require less than 1% of UPS load ride through can be extended for several minutes.
Other advantages of fan removal include: Improved disk I/O performance improvement (no vibration), happier sys admins (no noise and no of air induced temperature extremes).
The cooling systems are fully compatible with existing infrastructure and practices and virtually no training is required.